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  • IEC 60749-15-2020 半導(dǎo)體器件--機(jī)械和氣候試驗(yàn)方法--第15部分:通孔安裝器件的耐焊接溫度 Semiconductor devices &n...2023-08-24
  • GB/T 36474-2018 半導(dǎo)體集成電路 第三代雙倍數(shù)據(jù)速率同步動態(tài)隨機(jī)存儲器 (DDR3 SDRAM)測試方法 Semiconductor integ...2023-08-22
  • BS EN IEC 62435-4-2018 Electronic components. Long-term storage of electronic semiconductor devices. Stora...2023-08-07
  • IEC 60747-16-5-2020 半導(dǎo)體器件--第16-5部分:微波集成電路--振蕩器 Semiconductor devices – Part 16-5: Mic...2023-08-04
  • BS IEC 62047-36-2019 Semiconductor devices. Micro-electromechanical devices. Environmental and dielectric ...2023-08-01
  • EN IEC 60191-1-2018 Mechanical standardization of semiconductor devices. Part 1: General rules for the prep...2023-08-01
  • GB/T 7423.3-1987 半導(dǎo)體器件散熱器 叉指形散熱器 Heat sink of semiconductor devices--Heat sink, staggered fing...2023-07-25
  • DIN EN 60747-16-3-2018 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency convert...2023-07-19
  • BS EN 60191-4-2014+A1-2018 Mechanical standardization of semiconductor devices. Coding system and classifi...2023-07-16
  • DIN EN IEC 60749-12-2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration,...2023-06-28
  • EN 60747-16-1-2002+A2-2017 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers2023-06-27
  • EN 60191-4-2014+A1-2018 Mechanical standardization of semiconductor devices. Part 4: Coding system and clas...2023-06-18
  • BS IEC 62830-3-2017 半導(dǎo)體器件 用于能量收集和生成的半導(dǎo)體器件 第3部分:基于振動的電磁能量收集 Semiconductor d...2023-06-16
  • IEC 60747-5-11-2019 半導(dǎo)體器件--第5-11部分:光電子器件--發(fā)光二極管--發(fā)光二極管的輻射和非輻射電流的試驗(yàn)方法 Se...2023-06-13
  • BS EN 62047-25-2016 半導(dǎo)體器件 微機(jī)電設(shè)備 基于硅的MEMS制造技術(shù) 微結(jié)合區(qū)的拉壓和剪切強(qiáng)度測量方法 Semiconducto...2023-06-12
  • GB/T 7581-1987 半導(dǎo)體分立器件外形尺寸 Dimensions of outlines for semiconductor discrete devices2023-06-12
  • GB/T 14028-2018 半導(dǎo)體集成電路 模擬開關(guān)測試方法 Semiconductor integrated circuits-Measuring method of analog...2023-06-12
  • BS IEC 63068-2-2019 Semiconductor devices. Non-destructive recognition criteria of defects in silicon carb...2023-06-08
  • IEC 60749-5-2017 半導(dǎo)體設(shè)備--機(jī)械和氣候試驗(yàn)方法--第5部分:穩(wěn)定狀態(tài)溫度濕度偏重生命試驗(yàn) Semiconductor devices ...2023-06-03
  • BS EN 62047-21-2014 半導(dǎo)體裝置 微機(jī)電設(shè)備 MEMS薄膜材料泊松比的測試方法 Semiconductor devices. Micro-electrom...2023-05-17
  • BS IEC 62951-5-2019 Semiconductor devices. Flexible and stretchable semiconductor devices. Test method for...2023-05-15
  • GB/T 4937.15-2018 半導(dǎo)體器件 機(jī)械和氣候試驗(yàn)方法 第15部分:通孔安裝器件的耐焊接熱 Semiconductor devices--Mecha...2023-05-13
  • EN IEC 62969-3-2018 Semiconductor devices. Semiconductor interface for automotive vehicles. Part 3: Shock d...2023-05-10
  • BS EN IEC 60749-17-2019 Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation2023-05-05
  • GB/T 41040-2021 宇航用商業(yè)現(xiàn)貨（COTS）半導(dǎo)體器件 質(zhì)量保證要求 COTS semiconductor parts for space application- Qu...2023-05-02
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