This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the 
purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid 
environments. 
This test method is considered destructive.dition 2.0 2017-04 INTERNATIONAL STANDARD Semiconductor devices – Mechanical and climatic test methods – Part 5: Steady-state temperature humidity bias life test IEC 60749-5:2017-04(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ？ 2017 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any mean