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  • GB/T 18904.4-2002半導(dǎo)體器件 第12-4部分;光電子器件 纖維光學(xué)系統(tǒng)或子系統(tǒng)用帶/不帶尾纖的pin-FET模塊空白詳細(xì)規(guī)...2022-06-10
  • SJ 51420/1-1996半導(dǎo)體集成電路D型陶瓷雙列外殼詳細(xì)規(guī)范Detail specification of type D ceramic DIP for semicondu...2022-06-10
  • SJ 20069-1992半導(dǎo)體分立器件.2CK76型硅開關(guān)二極管詳細(xì)規(guī)范Semiconductor discrete device-Detail specification fo...2022-06-10
  • SJ 20186-1992半導(dǎo)體分立器件2CW2970～3015型硅電壓調(diào)整二極管詳細(xì)規(guī)范Semiconductor discrete device-Detail specifi...2022-06-10
  • SJ 20011-1992半導(dǎo)體分立器件GP、GT和GCT級(jí)CS1型硅N溝道耗盡型場(chǎng)效應(yīng)晶體管.詳細(xì)規(guī)范Semiconductor discrete device...2022-06-10
  • SJ 50033/107-1996半導(dǎo)體分立器件.2EY621、2EY622、2EY623型體效應(yīng)二極管詳細(xì)規(guī)范Semiconductor discrete device-De...2022-06-10
  • GB/T 14264-2009半導(dǎo)體材料術(shù)語Semiconductor materials—Terms and definitions2022-06-10
  • SJ 20161-1992半導(dǎo)體集成電路JT54LS273（373、374和377）型LS-TTL可級(jí)聯(lián)觸發(fā)器詳細(xì)規(guī)范Detail specification for types ...2022-06-10
  • SJ 50033/169-2004半導(dǎo)體分立器件.3DA510型硅微波脈沖功率晶體管詳細(xì)規(guī)范Semiconductor discrete devices Detail sp...2022-06-10
  • SJ 50033/111-1996半導(dǎo)體光電子器件GTI6型硅NPN光電晶體管詳細(xì)規(guī)范Semiconductor optoelectronic devices-Detail sp...2022-06-10
  • SJ 50597/21-1994半導(dǎo)體集成電路.JADC1001型通用8位二進(jìn)制輸出A/D轉(zhuǎn)換器詳細(xì)規(guī)范Semiconductor integrated circuits...2022-06-10
  • SJ 50033/72-1995半導(dǎo)體分立器件.PIN323型PIN二極管詳細(xì)規(guī)范Semiconductor discrete device-Detail specification f...2022-06-10
  • SJ/T 10424-1993半導(dǎo)體器件用鈍化封裝玻璃粉Glass powder for passivation packaging for use in semiconductor dev...2022-06-10
  • GB/T 6219-1998半導(dǎo)體器件 分立器件 第8部分;場(chǎng)效應(yīng)晶體管 第一篇 1GHz、5W以下的單柵場(chǎng)效應(yīng)晶體管空白詳細(xì)規(guī)范...2022-06-09
  • GB/T 17572-1998半導(dǎo)體器件 集成電路 第2部分;數(shù)字集成電路 第四篇 CMOS數(shù)字集成電路 4000B和4000UB系列族規(guī)范...2022-06-09
  • SJ 50033/78-1995半導(dǎo)體分立器件.CS0464型砷化鎵微波場(chǎng)效應(yīng)晶體管詳細(xì)規(guī)范Semiconductor discrete devices-Detail s...2022-06-09
  • SJ 2065-1982半導(dǎo)體器件生產(chǎn)用擴(kuò)散爐測(cè)試方法Testing method for diffusion furnace for semiconductor device manu...2022-06-09
  • SJ 50033/94-1995半導(dǎo)體分立器件.3DG143型NPN硅高頻低噪聲小功率晶體管詳細(xì)規(guī)范Semiconductor discrete devices-Det...2022-06-09
  • SJ 20014-1992半導(dǎo)體分立器件GP、GT和GCT級(jí)3CG110型PNP硅小功率晶體管.詳細(xì)規(guī)范Semiconductor discrete device-Deta...2022-06-09
  • SJ 50033/166-2004半導(dǎo)體分立器件.3DA507型硅微波脈沖功率晶體管詳細(xì)規(guī)范Semiconductor discrete devices Detail sp...2022-06-09
  • SJ 50033/92-1995半導(dǎo)體分立器件.3CD100型低頻大功率晶體管詳細(xì)規(guī)范Semiconductor discrete devices-Detail specifi...2022-06-08
  • GB/T 14119-1993半導(dǎo)體集成電路雙極熔絲式可編程只讀存儲(chǔ)器空白詳細(xì)規(guī)范Blank detail specification for semiconduc...2022-06-08
  • SJ 2684-1986半導(dǎo)體發(fā)光(可見光)器件外形尺寸Physical demensions for light emitting device of semiconductor...2022-06-08
  • GB/T 11685-2003半導(dǎo)體X射線探測(cè)器系統(tǒng)和半導(dǎo)體X射線能譜儀的測(cè)量方法Measurement procedures for semiconductor X-...2022-06-08
  • GB/T 17574-1998半導(dǎo)體器件 集成電路 第2部分;數(shù)字集成電路Semiconductor devices --Integrated circuits Part 2:...2022-06-06
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