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首頁 > 標準下載>IEC TS 60747-19-2-2021 半導體器件--第19-2部分:智能傳感器--驅(qū)動智能傳感器低功耗運行的傳感器和電源規(guī)范指示 Semiconductor devices – Part 19-2: Smart sensors – Indication of specifications of sensors and power supplies to drive smart sensors for low power operation免費下載
IEC TS 60747-19-2-2021 半導體器件--第19-2部分:智能傳感器--驅(qū)動智能傳感器低功耗運行的傳感器和電源規(guī)范指示 Semiconductor devices – Part 19-2: Smart sensors – Indication of specifications of sensors and power supplies to drive smart sensors for low power operation IEC TS 60747-19-2-2021 半導體器件--第19-2部分:智能傳感器--驅(qū)動智能傳感器低功耗運行的傳感器和電源規(guī)范指示 Semiconductor devices – Part 19-2: Smart sensors – Indication of specifications of sensors and power supplies to drive smart sensors for low power operation

IEC TS 60747-19-2-2021 半導體器件--第19-2部分:智能傳感器--驅(qū)動智能傳感器低功耗運行的傳感器和電源規(guī)范指示 Semiconductor devices – Part 19-2: Smart sensors – Indication of specifications of sensors and power supplies to drive smart sensors for low power operation

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  • 標準編號:IEC TS 60747-19-2-2021
  • 標準狀態(tài):現(xiàn)行
  • 更新時間:2024-01-23
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This part of IEC 60747 provides a guideline of indication of specifications of a low-power sensor being a device or a module allowing autonomous power supply operation, which contributes to the low-power design of a smart sensing unit. Here, the smart sensing unit comprises a smart sensor, a terminal module, and a power supply, which can send output data of the smart sensor to the outside. This part also provides a guideline of indication of specifications of the power supply to drive the smart sensor(s) in the smart sensing unit. Based on these, the three components of the smart sensing unit can be easily selected and combined from the point-of- view of newly designed, low-power, smart sensing units.dition 1.0 2021-05 TECHNICAL SPECIFICATION Semiconductor devices – Part 19-2: Smart sensors – Indication of specifications of sensors and power supplies to drive smart sensors for low power operation IEC TS 60747-19-2:2021-05(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ? 2021 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be repro

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