This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.dition 1.0 2021-03 INTERNATIONAL STANDARD colour inside Printed electronics – Part 202-7: Materials – Printed film – Measurement of peel strength for printed layer on flexible substrate by the 90° peel method IEC 62899-202-7:2021-03(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ？ 2021 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may b