used in the printing process to form electronic components/devices. This international
standard is also applied to the substrates which make surface treatment in order to improve
their performance.">

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IEC 62899-201-2016 印刷電子--第201部分:材料-基質(zhì)
 Printed electronics –
Part 201: Materials – Substrates IEC 62899-201-2016 印刷電子--第201部分:材料-基質(zhì)
 Printed electronics –
Part 201: Materials – Substrates

IEC 62899-201-2016 印刷電子--第201部分:材料-基質(zhì) Printed electronics – Part 201: Materials – Substrates

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  • 標準編號:IEC 62899-201-2016
  • 標準狀態(tài):現(xiàn)行
  • 更新時間:2023-10-12
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This part of IEC 62899 defines the terms and specifies the evaluation method for substrates used in the printing process to form electronic components/devices. This international standard is also applied to the substrates which make surface treatment in order to improve their performance.dition 1.0 2016-02 INTERNATIONAL STANDARD Printed electronics – Part 201: Materials – Substrates IEC 62899-201:2016-02(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ? 2016 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfi

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